ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,569, issued on Sept. 9, was assigned to RAIMONDI S.P.A. (Modena, Italy). "Vibration compactor" was invented by Riccardo Sighinolfi (Rubier... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,062, issued on Sept. 9, was assigned to Tonnjes ISI Patent Holding GmbH (Delmenhorst, Germany). "Method and device for providing a licence... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,402, issued on Sept. 9, was assigned to IRPI LLC (Wilsonville, Ore.) and The United States of America as represented by the Administrator o... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,130, issued on Sept. 9, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Light-emitting device and electronic apparatus... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,264, issued on Sept. 9, was assigned to Japan Wind Tunnel Manufacturing Inc. (Kurume, Japan), NISHIYAMA Corp. (Tokyo) and Yamato Scale Co. ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,413,489, issued on Sept. 9, was assigned to AMAZON TECHNOLOGIES INC. (Seattle). "Managing radio-based private networks" was invented by Diwaka... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,411, issued on Sept. 9, was assigned to HYPHA DISCOVERY Ltd. (Abingdon, Great Britain). "Biocatalytic techniques" was invented by Jonathan... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,550, issued on Sept. 9. "Display screen with graphical user interface" was invented by Gabriel Braun (Jacksonville, Fla.). The patent was... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,288, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device with a ve... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,857, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Hybrid micro-bump integration with... Read More